Test-in-Tray Automates Semiconductor Back-End Processes

Test-in-Tray (TnT) techniques have the potential to reduce dramatically the WIP, cost and custom fixturing in semiconductor back-end processes. Devices are carried in standardized trays throughout back end processing including burn-in, trim, test, sort and mark all the way to final packing. Once in the tray, direct handling of devices is eliminated, whether manual or robotic.

Standardized carriers transport arrays of devices through back end processes with a minimum of custom fixtures. Handlers and automation can be reused and rapidly reconfigured. With very rapid index times and virtually unlimited parallelism, handling is no longer a bottleneck. TnT methods can be extended to intelligent burn-in, where trays are loaded into burn-in pods as determined by the test data, with full traceability. Centipede supports open standards and interoperability of TnT components.

With the ever increasing complexity of IC devices, the industry faces an upward spiral of costs for burn-in and test. TnT offers a technology learning curve to reduced costs rather than a dead end race to the lowest wage venue.