Thermal Management

Parallel Testing

Bare Die

– Wide Range -65ºC to +160ºC

– Tri-temp

– Rapid Thermal Response

– High Power Cooling

Fastest thermal response for
bare die testing.

– Unlimited Parallelism

– Fast Index Times

– Seemless Burn-in & Test

– Cost Effective KGD

– Test Before/After Stacking

– Test-in-Tray

– Contactors

Advantest uses Centipede
Micro-torq wafer probe for full
wafer testing.